High Thermal Conductivity: Efficiently transfers heat away from CPUs and computer chips to maximize cooling performance.
Non-Conductive & Safe: Formulated with zero electrical conductivity to prevent short circuits and protect sensitive internal components.
10-Year Extended Durability: Fills microscopic gaps between the processor and heatsink to maintain thermal performance for up to a decade.
Syringe Applicator with Rubber Cap: Convenient syringe design ensures precise application, while the airtight rubber cap prevents the compound from drying out between uses.
Visual Syringe Measurement Scale: Clear graduation markings on the barrel allow users to easily track and control the amount of paste applied.
Optimum Viscosity & Particle Density: Engineered particle size allows smooth, uniform spreading across various chip surfaces under cooler mounting pressure.
RoHS-Compliant & Eco-Friendly: Made with environmentally safe, non-toxic materials that fully comply with hazardous substance standards.
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